The 500 GHz Processor
![](http://www.cstl.nist.gov/div837/Division/images/semi3.gif)
The introduction of germanium into silicon wafers yields substantial performance benefits while maintaining the many advantages of silicon. IBM has been experimenting with SiGe technology for over 15 years and has been producing high-volume SiGe chips for various industries since 1998. This new chip represents a significant leap forward not only because of the chip's high clock speed and low power consumption, but because the chip is compatible with existing standard high-volume silicon-based manufacturing techniques. This new technology is believed to lend itself to continued improvement and in the future is expected to support room temperature operational speeds in the Terahertz range (1 THz = 1 TRILLION cycles per second)!
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